- Attachment Method：
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- Material：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM |
3,238
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 COPPER |
5,825
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 COPPER |
7,803
In-stock
|
View details Get Quote |
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