Image Part Manufacturer Description Stock Action
HSB04-171706 CUI Devices
HEAT SINK, BGA, 17 X 17 X 6 MM
RFQ
2,904
In-stock
View details Get Quote
HSS07-C20-P274 CUI Devices
HEAT SINK, STAMPING, TO-220, 21.
RFQ
1,643
In-stock
View details Get Quote
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