- Manufacturer：
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- BOYD (1)
- Comair Rotron (1)
- Attachment Method：
-
- Fin Height：
-
- Package Cooled：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 43MM SQ BLK H=.65" |
4,693
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEATSINK 1.95" TO220 |
6,259
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK TO PKG FOLDED FIN |
7,368
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
9,006
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 24.1X48.3X49.5MM |
6,763
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
8,860
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
7,929
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 43MM SQ BLK H=.65" |
5,749
In-stock
|
View details Get Quote |
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