- Attachment Method：
-
- Fin Height：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 6 MM |
1,236
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM |
1,761
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 27. |
364
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.