- Attachment Method:
-
- Length:
-
- Package Cooled:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M |
3,576
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM |
1,068
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 12 X 12 X 18 MM |
2,082
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19. |
4,992
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
6,329
In-stock
|
View details Get Quote |









