Image Part Manufacturer Description Stock Action
HSB05-171711 CUI Devices
HEAT SINK, BGA, 17 X 17 X 11.5 M
RFQ
3,576
In-stock
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HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
RFQ
1,068
In-stock
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HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 X 12 X 18 MM
RFQ
2,082
In-stock
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HSS14-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
RFQ
4,992
In-stock
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HSE-B1711-057 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
RFQ
6,329
In-stock
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