- Attachment Method：
-
- Fin Height：
-
- Material：
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- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.7W ALUMINUM |
3,946
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220/TO- |
534
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W ALUMINUM |
708
In-stock
|
View details Get Quote |
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