- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 SOLDERPIN 50.8MM |
4,996
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,939
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,947
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
7,155
In-stock
|
View details Get Quote |
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