Image Part Manufacturer Description Stock Action
HSS01-B20-CP CUI Devices
HEAT SINK, STAMPING, TO-220, 49.
RFQ
1,112
In-stock
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HSB21-454515 CUI Devices
HEAT SINK, BGA, 45 X 45 X 15 MM
RFQ
119
In-stock
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HSE-B381-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 38
RFQ
8,685
In-stock
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