- Manufacturer：
-
- BOYD (6)
- Comair Rotron (2)
- CUI Devices (1)
- Attachment Method：
-
- Fin Height：
-
- Length：
-
- Material：
-
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Natural：
-
12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK DPAK SMT TIN PLATED |
15,909
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 W/TAB .25 |
1,783
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 CLIP-ON/TAB |
6,758
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 CLIP-ON BLACK |
1,189
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 VERT/HORZ MOUNT |
4,538
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
788
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | BOARD LEVEL HEAT SINKS |
155
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 6.4X13.3X19.1MM |
5,224
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19X12.7X12.7MM |
5,298
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DPAK SMT TIN PLATED |
9,644
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,693
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
5,246
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.