- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT SINK |
9,507
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,947
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK EXTRUDED 16X16.5X50.8MM |
9,846
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.