Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSE06-503045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
1,101
In-stock
View details Get Quote
HSE07-753045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
971
In-stock
View details Get Quote
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