- Manufacturer:
-
- CUI Devices (2)
- Attachment Method:
-
- Fin Height:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,101
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
971
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
3
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
5,006
In-stock
|
View details Get Quote |









