- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK 31X31X14.5MM |
799
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 25 MM |
735
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 35X35X23MM ELLIPTICAL |
121
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 35X35X23MM PIN |
146
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK 29X29X19.5MM |
2,951
In-stock
|
View details Get Quote |









