- Attachment Method:
-
- Fin Height:
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- Material:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Thermal Resistance @ Natural:
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,101
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
971
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK HALF BRICK ALUM BLACK |
9,780
In-stock
|
View details Get Quote |









