Image Part Manufacturer Description Stock Action
HSB17-404025 CUI Devices
HEAT SINK, BGA, 40 X 40 X 25 MM
RFQ
735
In-stock
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ATS-EXL119-1220-R0 Advanced Thermal Solutions, Inc.
PCIE EXTRUSION PROFILE, AL6063
RFQ
3
In-stock
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ATS-EXL119-300-R0 Advanced Thermal Solutions, Inc.
PCIE EXTRUSION PROFILE, AL6063
RFQ
5,006
In-stock
View details Get Quote
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