- Manufacturer:
-
- BOYD (1)
- CUI Devices (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45MM X 16.5MM |
240
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,101
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45MM X 16MM |
6
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | COPPER HEATSINK 50X50X14MM |
6,107
In-stock
|
View details Get Quote | ||
|
BOYD | COPPER HEATSINK 50X50X14MM |
9,085
In-stock
|
View details Get Quote |









