- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Fin Height：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
8,685
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK ELLIP FIN 31X31MM CLIP |
8,283
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.