- Manufacturer：
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- BOYD (12)
- Comair Rotron (1)
- CTS Corporation (2)
- Attachment Method：
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42 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEATSINK 1" TO-220 |
8,526
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
2,538
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-218 SOLDER PIN |
18,612
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45MM X 7.5MM |
159
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30MM X 9MM |
511
In-stock
|
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|
|
BOYD | HEATSINK TO-220 TAB FOLD 41.15MM |
3,631
In-stock
|
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|
|
Wakefield Thermal | HEATSINK 19X28MM FRONT PUSH PIN |
848
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | MAXFLOW HEAT SINK BLK T412 |
782
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45MM X 7.5MM |
1,037
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45MM X 9.5MM |
143
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31MM X 24.5MM |
50
In-stock
|
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|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
8
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | MAXIFLOW 44.25X44.25X9.5MM T766 |
99
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45MM X 8.5MM |
72
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45MM X 8.5MM |
41
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X28MM DIA PUSH PIN |
88
In-stock
|
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|
|
Wakefield Thermal | HEATSINK 19X28MM SIDE PUSH PIN |
32
In-stock
|
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|
|
CTS Corporation | HEATSINK FORGED W/ADHESIVE TAPE |
9,201
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
6,868
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MM X 58.2MM X 5.5MM |
12
In-stock
|
View details Get Quote |
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