- Manufacturer：
-
- BOYD (9)
- Comair Rotron (1)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Natural：
-
15 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 W/PINS 1" TALL |
13,036
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 BLACK 1" |
3,898
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 SOLDERPIN/CLIP |
5,103
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 W/PINS 1" TALL |
7,647
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
5,403
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,303
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,532
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUD 12.7X34.9X25.4MM |
7,744
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
8,441
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
9,626
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR BGAS FIN HGT .45" |
9,117
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR BGAS FIN HGT .45" |
5,240
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
5,555
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,863
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,887
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.