- Manufacturer:
-
- BOYD (7)
- Comair Rotron (1)
- Ohmite (3)
- Attachment Method:
-
- Fin Height:
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- Length:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Natural:
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16 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 SNAP-DOWN .75" |
14,291
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 35MM SQ H=.45" BLK |
1,280
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEATSINK .515"TO-220 |
834
In-stock
|
View details Get Quote | ||
|
BOYD | BGA HEAT SINK |
3,616
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO-220 SNAP-DOWN .75" |
4,620
In-stock
|
View details Get Quote | ||
|
Ohmite | 25MM LG, DEGREASED HEAT SINK |
128
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,318
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 9.5X19X19MM |
5,645
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
9,245
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
6,805
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
7,664
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM BGA |
5,027
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
5,580
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
5,643
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK FOR TO-126 25MM |
7,520
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK FOR TO-126 25MM |
6,636
In-stock
|
View details Get Quote |









