- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | 1/8 BRICK HEATSINK 23X59X11.4MM |
177
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23MM X 12.5MM |
197
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ALUMINUM |
1,282
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
2,841
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23MM X 12.5MM |
37
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 23X23X12.5MM |
87
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
9,173
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X12.5MM W/OUT TIM |
10
In-stock
|
View details Get Quote |
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