- Manufacturer：
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- Cooling Source (1)
- CUI Devices (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Type：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X12MM |
24
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 30X30X10MM |
32
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W ALUMINUM |
6,894
In-stock
|
View details Get Quote |
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