- Manufacturer：
-
- CUI Devices (2)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 31 |
1,245
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 17.5MM |
1,360
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 19X19X17.5MM |
753
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 29. |
2,631
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 17.5MM |
498
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X17.5MM W/OUT TIM |
9,366
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.