- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Fin Height:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK FOR TI MOD #TPA3130D |
5,857
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 23. |
4,826
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK FOR TI MOD #TPA3116D |
8,152
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK FOR TI MOD #TPA3118D |
8,188
In-stock
|
View details Get Quote |









