- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Fin Height:
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- Material:
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- Material Finish:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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14 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 7.5MM |
167
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM |
1,068
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X12MM FRONT PUSH PIN |
1,439
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X12MM SIDE PUSH PIN |
185
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17MM X 24.5MM |
102
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 9.5MM |
102
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | MAXIFLOW 24.25X24.25X9.5MM T766 |
99
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 7.5MM |
97
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK PASSIVE BGA SPREAD CLP |
67
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 25X25X7.5MM |
66
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X12MM DIA PUSH PIN |
5,557
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 7.5MM |
7,962
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 17X17X24.5MM W/OUT TIM |
8,610
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X7.5MM W/OUT TIM |
9,629
In-stock
|
View details Get Quote |









