- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
119
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40MM X 9.5MM |
841
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40MM X 9.5MM |
78
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 40X40X7.5MM |
17
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
7,137
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X9.5MM W/OUT TIM |
6,529
In-stock
|
View details Get Quote |
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