- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 6 MM |
1,236
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 12 X 12 X 18 MM |
2,082
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | 1/2 BRICK HEATSINK 61X58X6.1MM |
73
In-stock
|
View details Get Quote |









