- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Attachment Method：
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- Fin Height：
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM |
1,761
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
446
In-stock
|
View details Get Quote |
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