- Attachment Method：
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- Fin Height：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M |
3,576
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19. |
4,992
In-stock
|
View details Get Quote |
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