- Manufacturer:
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- CTS Corporation (1)
- CUI Devices (1)
- Attachment Method:
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- Fin Height:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK CPU W/ADHESIVE 1.01"SQ |
3,359
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
1,930
In-stock
|
View details Get Quote |









