- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
567
In-stock
|
View details Get Quote | ||
|
|
BOYD | BGA HEAT SINK |
3,616
In-stock
|
View details Get Quote |
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