- Manufacturer：
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- BOYD (4)
- Attachment Method：
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- Fin Height：
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- Length：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
3,765
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
16
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
43
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
5,723
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
7,015
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,333
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,764
In-stock
|
View details Get Quote |
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