- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (1)
- Attachment Method:
-
- Material:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED BLK ANO TOP MNT |
6,463
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
7,114
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK PIN FIN 37X37MM CLIP |
6,862
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK ELLIP FIN 37X37MM CLIP |
6,012
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK ELLIP FIN 31X31MM CLIP |
5,864
In-stock
|
View details Get Quote |









