- Manufacturer:
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- BOYD (1)
- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 35X35X23MM ELLIPTICAL |
121
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 35X35X23MM PIN |
146
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
299
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
5,496
In-stock
|
View details Get Quote |









