- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION,TO-218, 25. |
1,798
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED BLK ANO TOP MNT |
9,408
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
9,864
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.