- Manufacturer：
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- CUI Devices (1)
- Malico (2)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Malico | AL HEAT SINK 21X21X23MM WITH PIN |
224
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
942
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 19X19X28MM WITH PIN |
100
In-stock
|
View details Get Quote |
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