- Manufacturer:
-
- CUI Devices (1)
- Ohmite (1)
- Attachment Method:
-
- Diameter:
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- Fin Height:
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- Material:
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- Package Cooled:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Type:
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEAT SINK ELLIP FIN 19X19MM CLIP |
230
In-stock
|
View details Get Quote | ||
|
Ohmite | BGA HEATSINK W/TAPE |
6,112
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASSY |
9,155
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK PIN FIN 19X19MM CLIP |
7,971
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X21X23MM ELLIPTICAL |
6,194
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK HALF BRICK ALUM BLACK |
7,807
In-stock
|
View details Get Quote |









