- Manufacturer：
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- BOYD (10)
- CTS Corporation (1)
- Ohmite (2)
- Attachment Method：
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- Diameter：
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- Fin Height：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Width：
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27 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 W/PINS 1.5"TALL |
14,881
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSINK .45" D2PAK |
15,890
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-263 (D2PK) |
9,392
In-stock
|
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|
|
BOYD | HEATSINK TO-220 TAB FOLD 25.4MM |
21,350
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
12,389
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK TO-263 19.38X25.40MM |
10,683
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK ANOD ALUM |
2,465
In-stock
|
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|
|
Ohmite | HEATSINK W/CLIP FOR TO-264 |
169
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
135
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK |
6,721
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
5,578
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK PIN FIN 29X29MM CLIP |
6,194
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
8,960
In-stock
|
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|
|
Wakefield Thermal | HEAT SINK ELLIP FIN 27X27MM CLIP |
8,025
In-stock
|
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|
|
Wakefield Thermal | HEATSINK SMT PKG |
8,621
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
6,190
In-stock
|
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|
|
CTS Corporation | HEATSINK FORGED BLK ANO TOP MNT |
9,288
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
8,776
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | 35MM LOW P HS ASSY A- |
6,649
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | 37.5MM HS ASSY CL |
8,129
In-stock
|
View details Get Quote |
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