- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Fin Height:
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- Package Cooled:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Type:
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 58MM X 30MM X 9MM |
25
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK HALF BRICK ALUM BLACK |
9,780
In-stock
|
View details Get Quote |









