Manufacturer:
Attachment Method:
Material:
Material Finish:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSS-B20-0635H-01 CUI Devices
HEATSINK TO-220 2.7W ALUMINUM
RFQ
8,941
In-stock
View details Get Quote
208-75CTE Wakefield Thermal
HEATSINK
RFQ
5,709
In-stock
View details Get Quote
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