- Manufacturer：
-
- CUI Devices (1)
- Fin Height：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
TE Connectivity Raychem Cable Protection | HEAT SINK |
133
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM |
302
In-stock
|
View details Get Quote |
Copyright © 2009-2024 3j-limited.com . All Rights Reserved.