- Manufacturer：
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- BOYD (4)
- CUI Devices (3)
- Attachment Method：
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- Diameter：
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- Length：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-5 .75" BLACK |
1,431
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-5 .5" BLACK |
6,985
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
5,922
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
9,403
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
7,765
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,666
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
7,621
In-stock
|
View details Get Quote |
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