- Manufacturer:
-
- BOYD (1)
- CUI Devices (1)
- Ohmite (5)
- Seeed (1)
- Attachment Method:
-
- Fin Height:
-
- Length:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK TO-218,TO-220,TO-247 |
13,464
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK TO-220,TO-218,TO-247 |
6,442
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK TO-218,TO-220,TO-247 |
4,488
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK TO-218,TO-220,TO-247 |
395
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ALUMINUM |
1,282
In-stock
|
View details Get Quote | ||
|
Seeed | RASPBERRY PI COOLING DUAL FAN |
116
In-stock
|
View details Get Quote | ||
|
BOYD | 65715 EXTRUSION 0.39X1"X4' |
124
In-stock
|
View details Get Quote | ||
|
Ohmite | TO-220 HEAT SINK |
10
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.4W ALUMINUM |
5,795
In-stock
|
View details Get Quote |









