- Manufacturer：
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- Cooling Source (2)
- CUI Devices (1)
- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 37.4 X 37 X 10 M |
545
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 37.4X37.4 X10MM, INTERFACE MATER |
650
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 37.4X37.4 10MM |
653
In-stock
|
View details Get Quote |
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