- Manufacturer：
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- BOYD (1)
- CUI Devices (2)
- Seeed (1)
- Attachment Method：
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- Fin Height：
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- Length：
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- Material：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,563
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,907
In-stock
|
View details Get Quote | ||
|
|
Seeed | ALUMINUM HEATSINK WITH FAN FOR J |
248
In-stock
|
View details Get Quote | ||
|
T-Global Technology | ALUMINIUM HEAT SINK 38X38MM |
1,020
In-stock
|
View details Get Quote | ||
|
|
BOYD | 78075 EXTRUSION 2.13X1.5"X4.1' |
3
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 38X38MM |
33
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | CHIPSET HEATSINK FOR PHILIPS |
9,658
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 38X20MM |
5,043
In-stock
|
View details Get Quote |
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