- Manufacturer:
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- CUI Devices (3)
- iBASE Technology (1)
- Attachment Method:
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- Fin Height:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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15 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY W/ MOUNTING HAR |
229
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY W/ MOUNTING HAR |
94
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY W/ MOUNTING HAR |
50
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY W/ MOUNTING HAR |
43
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 60X40X8MM NVIDIA JETSON |
8,019
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 63X40X8MM NVIDIA JETSON |
9,190
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 63X40X8MM NVIDIA JETSON |
7,644
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | ACTIVE HEATSINK 63X40X8MM NVIDIA |
9,676
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | ACTIVE HEATSINK 63X40X8MM NVIDIA |
9,407
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 63X40X8MM NVIDIA JETSON |
7,674
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | ACTIVE HEATSINK 63X40X8MM NVIDIA |
8,179
In-stock
|
View details Get Quote | ||
|
iBASE Technology | HEATSINK;HSIBR117-B V-A |
1
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
6,232
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
5,072
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
7,137
In-stock
|
View details Get Quote |









