- Manufacturer：
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- BOYD (6)
- CUI Devices (1)
- Attachment Method：
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- Fin Height：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 W/PINS BLK 1" |
1,792
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
10,401
In-stock
|
View details Get Quote | ||
|
|
BOYD | MAX CLIP HEATSINK |
870
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 SOLDERPIN/CLIP |
1,273
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 41. |
1,969
In-stock
|
View details Get Quote | ||
|
|
BOYD | MAX CLIP HEATSINK |
527
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 SOLDERPIN/CLIP |
9,010
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,052
In-stock
|
View details Get Quote |
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