- Manufacturer:
-
- AMEC Thermasol (3)
- CUI Devices (39)
- Henkel/Loctite (9)
- Parker Chomerics (3)
- Shiu Li Technology (156)
- Backing, Carrier:
-
- Outline:
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- Product Status:
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- Shape:
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- Thermal Conductivity:
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- Thermal Resistivity:
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- Thickness:
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- Type:
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- Usage:
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249 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
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Parker Chomerics | THERM PAD 28X28MM PINK 1=8 |
400
In-stock
|
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Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
26
In-stock
|
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Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
86
In-stock
|
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Laird - Performance Materials | THERM PAD 101.6MMX101.6MM GRAY |
33
In-stock
|
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Shiu Li Technology | NON-SILICONE THERMAL CONDUCTIVE |
95
In-stock
|
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![]() |
Shiu Li Technology | NON-SILICONE THERMAL CONDUCTIVE |
94
In-stock
|
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![]() |
Shiu Li Technology | NON-SILICONE THERMAL CONDUCTIVE |
92
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
37
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
8,304
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
39
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
4
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
8
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
14
In-stock
|
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Henkel/Loctite | THERM PAD 406.4X203.2MM GREEN |
28
In-stock
|
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CUI Devices | THERM PAD 70X70MM 1 SHEET OF 18 |
31
In-stock
|
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Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
4
In-stock
|
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![]() |
Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
6,003
In-stock
|
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![]() |
Henkel/Loctite | THERM PAD 457.2X228.6MM GRAY |
2
In-stock
|
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Henkel/Loctite | THERM PAD 457.2X228.6MM GRAY |
2
In-stock
|
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Laird - Performance Materials | THERM PAD 228.6MMX228.6MM GRAY |
3
In-stock
|
View details Get Quote |